A New Generation of Packaging Material - Al/SiC Composite Plate

With the high performance and micromation development of electronic system, thermal management and electronic packaging are becoming more and more important. Matched thermal expansion, high thermal conductivity and low density are three basic elements to be considered for modern electronic packaging material. In incorporation of stronger performance into smaller components, temperature control has been a critical challenge. The pressing challenge of thermal dissipation always occurs to electronic devices, printed circuit board and the new LED lights. Cu-W、Cu-Mo、Kovar alloy、Be-BeO have their own problems such as high density, poor thermal conductivity, large thermal expansion coefficient. Therefore, it is urgent to develop a packaging material with light weight, low thermal expansion coefficient and high thermal conductivity.

Al/SiC composite material is the most advanced material in application, featuring light weight, adjustable thermal expansion coefficient, good thermal conductivity, even distribution and homogeneity of Al/SiC. With the content between 30-70, SiC is used to adjust thermal expansion coefficient and thermal conductivity. Low, medium and high SiC content materials are alternatives of aluminum alloy, hart-to-process beryllium material, Cu-Wand and Kovar alloy respectively. Lower cost and higher performance promise it a broad application prospect.